EnSilica secures £10.4m from the UK Space Agency to develop satellite connectivity chips.
The grant from the UK Space Agency supports the development of advanced semiconductor chips for multi-constellation satellite user terminals.
EnSilica designs and manufactures custom mixed-signal application-specific integrated circuits for automotive, industrial, and communications sectors.
EnSilica has secured £10.4m from the UK Space Agency through the Connectivity in Low Earth Orbit programme to advance next-generation satellite broadband user terminals.
The three-year project will focus on developing semiconductor chips for high-performance, mass-market satellite broadband user terminals compatible with multiple constellations, reducing costs and power consumption.
The funding builds upon previous collaborations between the chip maker and both the UK Space Agency and the European Space Agency, reinforcing domestic capability in the space communications sector.
From the founder
"This is a great opportunity to accelerate our chipset development enabling us to extend our portfolio of chips for the satellite broadband market with a focus on providing a complete solution for user terminals while reducing cost and power."
Paul Morris
VP RF and Comms Business Unit at EnSilica
Use of funds
- 01Continue product development
- 02Fund research and development
